Low Temperature Curing Epoxy Adhesive
SW-2651

Overview

SW-2651 two-component epoxy heat-resistant super adhesive, can be cured at room temperature, the curing heat release is gentle, and the internal stress of the cured material is low.

Features

  • Good toughness, good temperature resistance, water resistance, excellent electrical and mechanical properties. Heat resistance grade -55 ~ +125℃.

Applications

  • This product has excellent heat resistance after curing, suitable for heat resistant bonding or electronic packaging.

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