One-component epoxy adhesive
SW-G500,SW-G500-1

Overview

SW-G500 series is a one-component package, low temperature fast curing, good bonding strength epoxy adhesive.

Features

  • Low temperature curing, SW-G500 use temperature range -55℃~250℃; SW-G500-1 use temperature range -55℃~180℃.
  • Single-component packaging, easy to use.
  • Fast curing at low temperature, good adhesive strength.
  • Excellent thixotropy.

Applications

  • It is mainly used for the bonding of magnetic motor ferrite and the bonding of electronic components.
  • Application scope: bonding of metal, glass, ceramics, hard rubber, cement, plastic, wood and other materials.

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