One-component epoxy adhesive
SW-G500,SW-G500-1
Overview
SW-G500 series is a one-component package, low temperature fast curing, good bonding strength epoxy adhesive.
Features
- Low temperature curing, SW-G500 use temperature range -55℃~250℃; SW-G500-1 use temperature range -55℃~180℃.
- Single-component packaging, easy to use.
- Fast curing at low temperature, good adhesive strength.
- Excellent thixotropy.
Applications
- It is mainly used for the bonding of magnetic motor ferrite and the bonding of electronic components.
- Application scope: bonding of metal, glass, ceramics, hard rubber, cement, plastic, wood and other materials.
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