Low Temperature Resistant Semiconductor Epoxy Adhesive
SW-LTLVE -1,-4,5,-9

Overview

SW-LTLVE series epoxy adhesive is a two-components semiconductor grade epoxy adhesive product with low viscosity, long service life and good bonding properties. It is packaged in components A and B.

Features

  • The bonding process is simple, easy to use and takes a long time to operate.
  • It has good medium resistance (oil resistance, sulfuric acid resistance, hydrochloric acid resistance, strong alkali resistance, water resistance and other media).
  • The adhesive layer has good toughness, the stress on the glued parts is small, and it is non-toxic to users.
  • Ease of use: potting, encapsulating and bonding.
  • Flexible, low-stress adhesive that resists impact or vibration.

Applications

  • Semiconductor applications: flip-chip underfill, wafer-level spin coating, etc.
  • It has good adhesion to metal, glass, ceramics, plastics, rubber, wood and other homogeneous or dissimilar materials.

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