Low Temperature Curing Epoxy Adhesive
SW-RTCE-N

Overview

SW-RTCE-N epoxy adhesive is a room temperature curing, temperature -60 ℃ ~ 150 ℃ two-component modified epoxy adhesive.

Features

  • The bonding process is simple, easy to use, fast curing, and can be cured at -5℃ ~0℃
  • Has good resistance to media, oil, water, acid and alkaline and non-toxic to users and can also be bonded to wet or oily surfaces
  • The adhesive layer has good toughness and the stress on the glued parts is small.

Applications

  • Application scope: bonding of metal, glass, ceramics, hard rubber, cement, plastic, wood and other similar or dissimilar materials;
  • It has excellent comprehensive performance and a wide range of uses. It can be widely used in assembly or repair in various industries such as automobiles, aircraft, electronics, motors, instrumentation, machinery, and petroleum.

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