Low Temperature Curing Epoxy Adhesive
SW-RTCS-1
Overview
SW-RTCS-1 is a two-components temperature-resistant modified epoxy adhesive, low-temperature curing, gentle curing heat release, and good bonding performance.
Features
- Can be cured at low temperature and resistant to temperature-60～150℃;
- Good craftsmanship, easy to use, fast curing, suitable for continuous or intermittent perfusion;
- Good impregnation of the bonding surface and no corrosion to components;
- Has good resistance to media, oil, water, acid and alkali;
- The curing heat release is gentle, the adhesive layer has good toughness, and the stress on the glued parts is small;
- Solvent-free and non-toxic to users.
Applications
- Insulation potting of electronic and electrical components, etc.;
- Bonding of metal, glass, ceramics, hard rubber, cement, plastic, wood and other similar or dissimilar materials;
- Various electronic components, IC controls, cable joints, connectors, printed circuit boards, etc.bonding;
- Assembly or repair of automobiles, aircraft, instruments, construction, machinery and other industries.
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