Low Temperature Curing Epoxy Adhesive
SW-SME-B
Overview
SW-SME-B epoxy adhesive is a low temperature fast curing one-component adhesive with good bonding strength.
Features
- Low temperature curing, use temperature range -55℃~150℃.
- Single-component packaging, easy to use.
- Low temperature fast curing, good bonding strength.
- With certain thixotropy
Applications
- Mainly used for bonding of motor and electronic components.
- Wide range of applications: metal, glass, ceramics, hard rubber, cement, plastic, wood and bonding of other materials.
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