Low Temperature Curing Epoxy Adhesive
SW-SME-CB

Overview

SW-SME-CB epoxy adhesive is a low temperature fast curing one-component adhesive with good bonding strength.

Features

  • Low temperature curing, use temperature range -55℃~150℃.
  • Single-component packaging, easy to use.
  • Low temperature fast curing, good bonding strength.
  • It has certain thixotropy.

Applications

  • Mainly used for bonding of motor and electronic components.
  • Application: metal, glass, ceramics, hard rubber, cement, plastic, wood and other materials bonding.

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