Low Temperature Curing Epoxy Adhesive
SW-SME-G
Overview
SW-SME-G epoxy adhesive is a low temperature fast curing single component adhesive with good bonding strength.
Features
- Low temperature curing, use temperature range -55℃ ~ 150℃.
- Single-component packaging, easy to use.
- Low temperature fast curing, good bonding strength.
- It has good fluidity.
Applications
- Mainly used for bonding of motor and electronic components.
- Application: metal, glass, ceramics, hard rubber, cement, plastic, wood and other materials bonding.
Related Products
© All Rights Reserved.